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TSMC SVP Kevin Zhang says the company plans to open an advanced chip packaging plant in Arizona by 2029 and that construction has begun (Reuters) from Techmeme RSS feed.
TSMC SVP Kevin Zhang says the company plans to open an advanced chip packaging plant in Arizona by 2029 and that construction has begun (Reuters)
Reuters:
TSMC SVP Kevin Zhang says the company plans to open an advanced chip packaging plant in Arizona by 2029 and that construction has begun — Taiwan Semiconductor Manufacturing Co (2330.TW) plans to open a chip packaging plant in Arizona by 2029, an executive told Reuters.