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Sources: TSMC is close to finalizing specs for a new chip packaging method, known in the industry as "panel-level", to meet rising demand for powerful AI chips (Cheng Ting-Fang/Nikkei Asia) from Techmeme RSS feed.
Sources: TSMC is close to finalizing specs for a new chip packaging method, known in the industry as "panel-level", to meet rising demand for powerful AI chips (Cheng Ting-Fang/Nikkei Asia)
Cheng Ting-Fang / Nikkei Asia:
Sources: TSMC is close to finalizing specs for a new chip packaging method, known in the industry as “panel-level”, to meet rising demand for powerful AI chips — TAIPEI — Taiwan Semiconductor Manufacturing Co. is close to finalizing the specifications for a radically new approach …